Wafer-Compatible Micro Ball Inspection Repair System BM-1150WR
Reliable solder ball repairs are performed by a repair unit that has accumulated unique image processing and proven results.
The BM-1120WR, developed alongside our micro ball mounter, has been highly regarded worldwide due to its CCD inspection system and reliable ball repair function, establishing itself as a best-selling model. Its successor, the BM-1150WR, combines accumulated image processing technology with a proven repair unit, achieving further improvements in mounting accuracy. 【Features】 ■ High-speed inspection of ball missing, excess balls, and pitch using a 12M camera Supports inspection of two types of balls with different diameters ■ Two types of repair support ・(a) Ball missing: Ball placement after applying flux ・(b) Excess balls: Removal by nozzle suction ■ Compatible with silicon wafers and molded wafers ■ Equipped with automatic calibration function ■ Supports SECS/GEM and AGV (optional) *For more details, please refer to the PDF document or feel free to contact us.
- Company：日精 本社
- Price：Other
